36-EFT.WP.EDX.Current v1.0 | Chapter 16 — Design Protocols & Engineering Checklist

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Chapter 16 — Design Protocols & Engineering Checklist

I. Chapter Objectives & Scope

1. Objective: Turn the core dialect and validation gates of EDX.Current into an end-to-end design protocol and engineering checklist for layout/process/metrology/release, spanning concept → layout → metrology → inversion → acceptance → publication.
2. Scope: Interconnects and device interfaces from DC up to the microwave upper band; includes path engineering, in-window phase/group-delay metrics, high-frequency positive-real radiation correction, EMI/EMC continuity, and data & reproducibility release.
3. Shared arrival dialect (two equivalent forms; path/measure explicit; record delta_form):
   • Constant-factored: T_arr = ( 1 / c_ref ) * ( ∫ n_eff d ell )
   • General: T_arr = ( ∫ ( n_eff / c_ref ) d ell )

II. Golden Rules

• Path-minimization principle: subject to impedance/process constraints, minimize in the target band
  Σ_p w_p · ∫_{γ_p} n_eff d ell (the phase-linearity master rule).
• Explicit paths & arrival: every design review must provide layout ↔ gamma(ell) and arrival{form,gamma,measure,c_ref,delta_form}.
• Coherence-window first: compute with coherent summation inside the window; use energy composition outside to avoid spurious oscillations.
• Positive-real & causal: Re{Z_eft} ≥ 0 and K–K consistency are hard gates; kernel spectra must have no right-half-plane poles.
• Two-dialect agreement: for the same data, the two T_arr writings must agree within u(T_arr).
• Layout change ⇒ re-binding: any geometry/stackup/return-plane modification requires updating binding_ref and re-running path/arrival and acceptance gates.
• Metrology closed loop: align Design → Metrology → Inversion → PPC → Release; all artifacts meet the data contract and export an audit trail.

III. Engineering Workflow (six executable stages)

• Requirements & band definition: fix target ω ∈ [ω₁, ω₂], caps for E_phase/GDR, EMI modes, and compliance gates. Deliverables: requirement card, initial qa_gates.
• Topology & path prototyping: draft γ_main plus controlled γ_side; produce first-pass T_arr,p and w_p trends. Deliverables: prototype binding card.
• Layout & constraints: radius bends, length-matched splits, local returns, stitching-via rings, tapered connector/launch and ground fingers. Deliverables: binding_ref + design checklist.
• Metrology plan: port harmonization, de-embedding, timebase, path correction; define coherence-window sweep and radiation gates. Deliverables: metrology card.
• Prototype iteration: measure → invert → PPC until gates pass; if not, use the “failure-mode → remedy” table to close the loop.
• Release & hand-off: package data/pipeline/env-lock and audit; freeze baseline_id and binding_ref.

IV. Layout & Path Engineering Rules (verifiable)

• Return paths & stitching: at layer/plane transitions deploy stitching-via rings, constrain return-loop area, suppress w_side(omega) and ΔT_arr.
• Bends/splits: radius bends; length-match splits; close guard returns at endpoints and corners.
• Vias & plane transitions: control barrel/stub length; provide close returns across planes.
• Connectors/launches: taper geometry and optimize ground fingers to depress mode-conversion weights.
• Shielding & apertures: reduce seam effective conductance sigma_seam and effective aperture length; grid ground if needed.
• Material dispersion: apply band-limits/smooth priors to n_eff(omega) and σ_eff(omega) to avoid non-physical wiggles.

V. High-Frequency & Dispersion Acceptance (aligned with Chapter 12)

• Group delay & phase linearity:
  T_group(omega) = d/domega( arg Z_eft(omega) )
  KPIs:
  E_phase = max_ω | arg Z_eft(omega) − ( omega · T_arr + φ0 ) |
  GDR = max_ω | T_group(omega) − median_ω(T_group) |
• Radiation positive-real correction: enable ΔZ_rad(omega) and verify Re{ΔZ_rad} ≥ 0 and K–K consistency.
• Gate placeholders: E_phase ≤ E_phase_gate, GDR ≤ GDR_gate, min Re{Z_eft} ≥ 0.

VI. EMI/EMC Procedures (aligned with Chapter 13)

• Emission: sealing seams / improving returns must lower Re{ΔZ_rad} and |E_rad|/|I_CM| together.
• Immunity: under fixed injection, drifts in Δarg Z and T_group must track w_p predictions.
• Records: near/far-field scans, common-mode current, ΔZ_rad curves, and weight evolution.

VII. Metrology & Data (aligned with Chapters 9 & 15)

• Mandatory records: arrival{form,gamma,measure,c_ref,Tarr,u_Tarr,delta_form}, binding_ref, deemb, sync, qa_gates.
• Dataset & pipeline cards: follow Dataset/Pipeline v1.0; all files carry sha256 and an env_lock.

VIII. Implementation Binding & Inversion (aligned with I30/I40/Mx-*)

• I30: layout ↔ gamma(ell) binding, path weights, and arrival records.
• I40/Mx-*: compile / predict / jacobian / invert / ppc / export; evidence first, parsimony second; PPC residuals near-white to pass.

IX. Compliance & Acceptance Gates (unified list)

• Hard gates: check_dim = pass; Re{Z_eft} ≥ 0; K–K consistency; two-dialect T_arr agreement.
• Phase & group delay: E_phase and GDR within gates.
• Path robustness: ΔW = Σ_p | w_p(ω₂) − w_p(ω₁) | ≤ ΔW_gate.
• EMI/EMC: Re{ΔZ_rad} ≥ 0 and decreases after sealing; |E_rad|/|I_CM| meet targets.
• Repro & release: equivalence thresholds ε_Z / ε_φ / ε_w passed; audit trail complete.

Acceptance card (example):

design_acceptance:

project_id: "EDXCUR-PRJ-001"

binding_ref: "LAY2PATH-xxxx"

baseline_id: "BLSN-2025-EDX-001"

bands:

- {w1: ω1, w2: ω2}

metrics:

E_phase: {value: 0.032, gate: 0.05, pass: true}

GDR_ns: {value: 0.12, gate: 0.20, pass: true}

ΔW: {value: 0.18, gate: 0.25, pass: true}

passivity: {min_Re_Z: 0.0, pass: true}

KK: {consistency: "pass"}

Tarr_dual:

diff_s: 3.0e-12

u_Tarr_s:6.0e-12

pass: true

Re_dZrad_min: {value: 0.0, pass: true}

qa_gates: ["check_dim","passivity(Re{Z}≥0)","KK_consistency"]

arrival:

form: "n_over_c"

gamma: "explicit"

measure: "d_ell"

c_ref: 299792458.0

Tarr_s: 1.234e-09

u_Tarr_s: 6.0e-12

signoff:

design_owner: "..."

metrology_owner: "..."

date: "2025-09-15"

X. Quick Troubleshooting & Failure Modes (remedy table)

• Phase non-linearity (E_phase over gate): shrink the coherence window; optimize γ_main; add close returns & stitching; suppress w_side.
• Group-delay ripple (GDR over gate): smooth priors on K_s/K_t; reduce mode conversion; correct Δt_sync.
• Passivity/causality failure: band-limit kernels; re-check de-embedding and baseline; constrain kernel poles.
• EMI over target: seal apertures / shorten stubs / improve shielding continuity; re-verify Re{ΔZ_rad}.
• Two-dialect mismatch: re-check delta_form, units, and gamma(ell) records; recompute discrete integrals.
• Repro failure: environment lock / dependency fingerprint mismatch; complete audit trail & file hashes.

XI. Execution Checklist (attach with delivery)

checklist:

- [ ] Define target band & coherence window (ω1, ω2)

- [ ] Create binding_ref and map γ_main / γ_side

- [ ] Fill arrival (form/gamma/measure/c_ref/delta_form)

- [ ] Complete port harmonization / de-embedding / timebase / path correction

- [ ] Compute Z_eft / argZ / T_group / E_phase / GDR

- [ ] Enable ΔZ_rad and verify Re{ΔZ_rad} ≥ 0

- [ ] Inversion + PPC (residuals near-white)

- [ ] Two-dialect T_arr agreement (≤ u_Tarr)

- [ ] All gates passed (passivity / K–K / ΔW)

- [ ] Produce dataset / pipeline / env_lock / audit (sha256)

- [ ] Review & sign-off (design / metrology / QA)

XII. Correspondence & Degeneracy to the Classical Framework

XIII. Cross-Chapter Pointers & Summary

• Dependencies: S20-* (conservation & conduction), S40-* (relay kernels & weights), S50-* (impedance mapping), Chapter 8 (paths/arrival), Chapter 12 (HF/dispersion), Chapter 13 (EMI/EMC), Chapters 9 & 15 (metrology/data), I30/I40/Mx-* (binding/inversion).
• Summary: This chapter threads path → arrival → kernels → weights → impedance → metrology → data → compliance into an executable design protocol and engineering checklist, enforcing a unified dialect, hard gates, and reproducible release—so EDX.Current achieves predictive, tunable, and falsifiable engineering deployment.